IPC's J-STD-001 is recognized worldwide as the sole industry-consensus standard covering soldering materials and processes. This revision includes support for both traditional solder alloys and for lead-free manufacturing.Whenever possible, the criteria descriptions have been adjusted to make them easier to understand for materials, methods and verification for producing quality soldered inter...
IPC J-STD-001F is recognized worldwide as the sole industry-consensus standard covering soldering materials and processes. This revision includes support for both traditional solder alloys and for lead-free manufacturing. Examples of some of the significant changes are revision to plated-through hole, PTH, minimum fill requirements; criteria for two new SMT termination types; and expanded conformal coating criteria. Whenever possible, the criteria descriptions have been adjusted to make them easier to understand for materials, methods and verification for producing quality soldered interconnections and assemblies. The requirements for all three classes of construction are included. Full color illustrations are provided for clarity. This...
Ipc Sm 840 Solder Mask Pdf 29
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IPC-J-STD-001H is recognized globally for its criteria on soldering processes and materials. Updated with participants from 27 countries providing input and expertise, the IPC-J-STD-001H standard brings the latest criteria to the industry including guidance on the use of x-ray to inspect through-hole solder conditions that are not visible by any other means.
The standard has over 700 full-color pictures and illustrations. Included in the 19 chapters are criteria for wire prep, soldering to terminals, crimping of stamped and formed contacts and machined contacts, insulation displacement connectors, ultrasonic welding, splicing, connectors, molding, marking, coax/biax cables, wrapping/lacing, shielding, assembly and wire-wrap terminations.
This Addendum supplements or replaces specifically identified requirements of IPC J-STD-001, Revision G, for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space. 28 pages. Released April 2018.
This guide includes everything needed for repair and rework of electronic assemblies and printed circuit boards! IPC-7711B/7721C Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure applicability to both lead free and traditional SnPb soldered assemblies. Included in this revision are the procedures previously released as change pages, an updated general information and common procedures section, new procedures for BGAs using focused IR Reflow Systems with integral preheater and general updates to all other procedures.
IPC J-STD-001HS space and military addendum, supplements or replaces specifically identified requirements of IPC J-STD-001H requirements for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space and military applications. Pages: 36
This Addendum supplements or replaces specifically identified requirements of IPC J-STD-001, Revision F, for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space. 18 pages. Released December 2014.
Updated to Revision H of the latest IPC-A-610 industry standard for the Acceptability of Electronic Assemblies, this Training & Reference Guide illustrates critical acceptance criteria for the evaluation of surface mount solder connections.
At only 44 pages and a compact 5.5 x 8.5 inch (14 x 21.5 cm) size, these convenient spiral-bound manuals make it easy for your inspectors and operators to make the right solder joint acceptance decisions for all three classes of product.
Now updated to Revision H of the latest IPC-A-610 industry standard for the Acceptability of Electronic Assemblies, this Training & Reference Guide illustrates critical acceptance criteria for the evaluation of through-hole solder connections.
With only 30 pages and a compact 5.5 x 8.5 inch (14 x 21.5 cm) size, these convenient spiral-bound manuals make it easy for your inspectors and operators to make the right solder joint acceptance decisions for all three classes of product.
This handbook contains general information and descriptions of proven techniques for assembly and soldering electronic assemblies. Content was developed and reviewed by noted industry experts and experienced committee members. Sections include: handling electronic assemblies, design considerations, PCBs, components, solderability, materials, component mounting, solder techniques and connections, cleaning, conformal coating, encapsulation and potting, and rework and repair. 290 Pages. Released February 2012.
Revision "E" incorporates many new and expanded requirements in areas such as back-drilled structures, alternative surface finishes, copper wrap plating, marking inks, solderability testing, plating overhang, microsection evaluation, thermal shock and performance-based testing for microvia structures. For use with IPC-6011. Supersedes IPC-6012D.
The standard has over 700 full-color pictures and illustrations. Included in the 19 chapters are criteria for wire prep, soldering to terminals, crimping of stamped and formed contacts and machined contacts, insulation...
This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon and powder solders for electronic soldering applications; and for ''special'' electronic grade solders. This is a quality control standard and is not intended to relate directly to the material's performance in the manufacturing process. Solders for applications other than electronics should be procured using ASTM B-32. This standard is one of a set of three joint industry standards that prescribe the requirements and test methods for soldering materials to be used in the electronics industry. The other two standards in...
Provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. These procedures provide a minimum shelf life of 12 months from the seal date when properly implemented. Developed by IPC and JEDEC. 32 pages. Released April 2018.
The standard has over 700 full-color pictures and illustrations. Included in the 19 chapters are criteria for wire prep, soldering to terminals, crimping of stamped and formed contacts and machined contacts, insulation displacement connectors, ultrasonic welding, splicing, connectors, molding,...
IPC J-STD-001HS space and military addendum, supplements or replaces specifically identified requirements of IPC J-STD-001H requirements for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space and military applications. Published 05-01-2021. Pages: 36
Establishes the requirements for the evaluation of liquid and dry film solder mask material and for the determination of the acceptability of use on a standard printed board system. IPC-SM-840 provides two classes of requirements, T and H, to reflect functional performance requirements and testing severity based on industry/end use requirements. Coverage is given to adhesion, material qualification, resistances to solvents, and electrical requirements.
Ion Chromatography Testing provides cleanliness-related information, specifically individual ionic data values, for various types of samples, including, but not limited to, printed circuit boards, printed circuit assemblies, and soldering fluxes..
The influence of the presence of copper on the network formation and the surface chemistry of an epoxy acrylate based solder mask system were investigated, with regards to the application of solder masks on copper layer. The presence of copper within the bulk volume of the solder mask was characterized by utilizing scanning electron microscopy/focused ion beam and energy dispersive X-ray analysis. The copper originates from the copper layer underneath and decreases towards the surface. Differences in the network structure were analyzed by applying infrared spectroscopy in attenuated total reflection mode, which showed no changes in the network structure due to a copper layer underneath. The surface chemistry of two solder masks with different curing agents, amine and anhydride, was investigated for differences caused by changes in the curing behavior depending on copper complex formation. Surface chemistry was analyzed by applying X-ray photoelectron spectroscopy and time of flight secondary ion mass spectrometry. Measurable differences in the surface chemistry with regards to copper content are generated due to the copper layer underneath. However, through the optical contact angle method and pull-off test, no differences concerning wetting or adhesion behavior between the solder mask and an epoxy adhesive were observed. 2ff7e9595c
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